Heat-dissipating device

ABSTRACT

An exemplary heat-dissipating device includes a base having a first surface, and a number of fins extending from the first surface. Each fin includes a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface.

BACKGROUND

1. Technical Field

The present disclosure relates to thermal transmitting structures, and more particularly to a heat-dissipating device for enhancing heat dissipating efficiency.

2. Description of Related Art

Electronic components, such as semiconductor chips, are becoming progressively smaller with each new product release, while at the same time the heat dissipation requirements of these kinds of components are increasing due to their improved ability to provide more functionality. In many contemporary applications, a heat-dissipating device is one of the most efficient systems in use for transmitting heat energy away from such components.

A typical heat-dissipating device includes a base and a predetermined number of parallel fins projecting from an upper section of the base. The base includes a bottom surface. The cross-section of each fin is linear. In typical use, the bottom surface of the base is positioned against and is firmly held in contact with a heat transfer surface of an electronic device, in order to ensure better thermal transfer between the bottom surface and the heat transfer surface. The heat-dissipating device transfers the heat energy from the electronic device to an ambient environment with fins.

However, because the cross-section of each fin is linear, the heat dissipating area of each fin is very small. Accordingly, the heat dissipating efficiency of the heat-dissipating device is affected. In addition, many modern electronic devices are very compact and generate much heat, and in some cases the above-described heat-dissipating device may not be able to transfer heat energy from the electronic device to the ambient environment quickly enough. This is apt to produce hotspots in the heat-dissipating device, and usually results in non-uniform dissipation of heat energy from the heat-dissipating device. That is, the thermal operating efficiency of the heat-dissipating device may be unsatisfactory.

Therefore, it is desirable to provide a new heat-dissipating device, which can overcome the above mentioned limitations.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic, cross-sectional view of a heat-dissipating device according to a first embodiment.

FIG. 2 is a schematic, cross-sectional view of a heat-dissipating device according to a second embodiment.

FIG. 3 is a schematic, cross-sectional view of a heat-dissipating device according to a third embodiment.

DETAILED DESCRIPTION

Embodiments will now be described in detail below with reference to drawings.

Referring to FIG. 1, a heat-dissipating device 100, in accordance with a first embodiment, is shown. The heat-dissipating device 100 includes a base 10 and a plurality of parallel fins 20 extending from the base 10.

The base 10 includes a first surface 101 and a second surface 103 facing away from the first surface 101. The first surface 101 is configured for supporting the fins 20. The second surface 103 is firmly held in contact with an electronic device (not shown). The base 10 is preferably made of a material selected from the group consisting of copper, aluminum, stainless steel, and any suitable alloy thereof.

The fins 20 are preferably made of a material selected from the group consisting of copper, aluminum, stainless steel, and any suitable alloy thereof. In the present embodiment, the fins 20 are integrally molded with the base 10. In other embodiments, the fins 20 can be attached on the first surface 101 of the base 10 by welding.

Each of fins 20 includes a main body 201 and an extending portion 203 extending from the main body 201. In the present embodiment, each fin 20 has an L-shaped cross-section.

Each main body 201 is between the first surface 101 and the extending portion 203, and is perpendicular to the first surface 101. In the present embodiment, the main body 201 is a quadrate plate.

The extending portion 203 perpendicularly extends from an end portion 2011 of the main body 201. The end portion 2011 is distal from the first surface 101. In the present embodiment, the extending portion 203 is a quadrate plate.

In use, the second surface 103 is attached to the electronic device, and transfers heat energy from the electronic device to the fins 20. The transferred heat energy is released to an ambient environment with the fins 20.

Compared with a conventional heat-dissipating device, each fin 20 has an extending portion 203. Thus, the heat-dissipating area of each fin 20 is increased, while the volume of the heat-dissipating device 100 is unchanged. Accordingly, the present heat-dissipating device 100 with the extending portions 203 can quickly dissipate heat energy produced by the electronic device to the ambient environment. Thus, development of hotspots in the heat-dissipating device 100 can be avoided. This helps ensure that the heat-dissipating device 100 dissipates heat uniformly. Therefore, the thermal operating efficiency of the heat-dissipating device 100 is most apt to be satisfactory while the volume of the heat-dissipating device 100 is unchanged.

Referring to FIG. 2, a heat-dissipating device 200, in accordance with a second embodiment, is shown. The heat-dissipating device 200 includes a base 30 and a plurality of parallel fins 40 extending from the base 30.

The base 30 is similar to the base 10, except that the base 30 includes a metal layer 305 arranged over the second surface 303 of the base 30. The roughness of metal layer 305 is lower than 8 nanometers for reducing the roughness of the second surface 303, thereby increasing the contact area between the base 30 and the electronic device. Accordingly, the heat absorbing efficiency of the base 30 can be improved.

Each fin 30 is similar to each fin 20, except that a plurality of through holes 4031 are defined in each extending portion 403 for increasing the contact area between each fin 40 and air. Accordingly, the heat dissipating efficiency of each fin 40 can be improved.

Referring to FIG. 3, a heat-dissipating device 300, in accordance with a third embodiment, is shown. The heat-dissipating device 300 includes a base 50 and a plurality of parallel pins 60.

The base 50 is similar to the base 10, except that the base 50 has a sealed cavity 501 defined therein and a working fluid 503 contained in the sealed cavity 501. The working fluid 503 is configured for absorbing and transferring heat energy from the electronic device. The heated working fluid 503 is vaporized, and becomes vapor. The vapor reaching to the fins 50 is cooled. The cooled vapor becomes fluid, and transfers the heat energy to fins 50. The fins 50 transfer the heat energy to the ambient environment.

The fins 60 are similar to the fins 20, except that each fin 60 has a T-shaped cross-section.

While certain embodiments have been described and exemplified above, various other embodiments will be apparent to those skilled in the art from the foregoing disclosure. The disclosure is not limited to the particular embodiments described and exemplified but is capable of considerable variation and modification without departure from the scope and spirit of the appended claims. 

1. A heat-dissipating device comprising: a base, the base having a first surface, and a plurality of fins extending from the first surface, each fin comprising a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface.
 2. The heat-dissipating device of claim 1, wherein each extending portion has a plurality of through holes defined therein.
 3. The heat-dissipating device of claim 1, wherein each fin has an L-shaped or T-shaped cross-section.
 4. The heat-dissipating device of claim 1, wherein the base comprises a second surface facing away from the first surface and a metal layer arranged over the second surface.
 5. The heat-dissipating device of claim 4, wherein the roughness of the metal layer is smaller than 8 nanometers.
 6. The heat-dissipating device of claim 1, wherein the base comprises a sealed cavity defined therein and a working fluid contained in the sealed cavity.
 7. The heat-dissipating device of claim 1, wherein the fins are made of a material selected from the group consisting of copper, aluminum, stainless steel, and any suitable alloy thereof.
 8. A heat-dissipating device comprising: a base, the base having a first surface, a second surface facing away from the first surface, and a metal layer arranged on the second surface, and a plurality of fins arranged on the first surface, each fin comprising a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface.
 9. The heat-dissipating device of claim 8, wherein the roughness of the metal layer is smaller than 8 nanometers.
 10. The heat-dissipating device of claim 9, wherein each extending portion has a plurality of through holes defined therein.
 11. The heat-dissipating device of claim 9, wherein each fin has an L-shaped or T-shaped cross-section.
 12. The heat-dissipating device of claim 9, wherein the base comprises a sealed cavity defined therein and a working fluid contained in the sealed cavity.
 13. A heat-dissipating device comprising: a base, the base having a first surface, a sealed cavity defined therein, and a working fluid contained in the sealed cavity, and a plurality of fins arranged on the first surface, each fin comprising a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface.
 14. The heat-dissipating device of claim 13, wherein each extending portion has a plurality of through holes defined therein.
 15. The heat-dissipating device of claim 13, wherein each fin has an L-shaped or T-shaped cross-section.
 16. The heat-dissipating device of claim 13, wherein the base comprises a second surface facing away from the first surface and a metal layer arranged on the second surface.
 17. The heat-dissipating device of claim 16, wherein the roughness of the metal layer is smaller than 8 nanometers.
 18. The heat-dissipating device of claim 13, wherein the fins are made of a material selected from the group consisting of copper, aluminum, stainless steel, and any suitable alloy thereof. 